China's Silicon Secret: Is SMIC's N+3 Node Actually Outpacing Intel?
A deep dive into the Kirin 9030 reveals that SMIC's latest chip architecture might be pushing boundaries closer to Western rivals than previously imagined.
By Blip Tech
1 min read
Recent technical teardowns and engineering evaluations of Huawei's HiSilicon Kirin 9030 chip reveal significant advancements in SMIC’s fabrication capabilities. The analysis focuses on the N+3 node, SMIC’s third-generation 7nm process, comparing its minimum metal pitch and cell architecture against competitors like TSMC’s N6 and Intel’s upcoming 18A node. Despite global trade restrictions, the findings suggest that SMIC is refining its patterning and process technology to achieve transistor densities that challenge global benchmarks, marking a pivotal moment in the domestic Chinese semiconductor landscape and its push for chip self-sufficiency.
