iPhone 18 Could See A20 Chip Upgrades with New Packaging Tech
The A20 chip that will be used in the iPhone 18 could adopt new packaging technology, giving Apple more configuration options while maintaining a small size. This packaging technique would allow for different combinations of CPUs and GPUs without increasing costs significantly.
By Blip Tech
1 min read
The A20 chip that will be used in the iPhone 18 could be packaged with a new tech known as WMCM, which would give Apple more configuration options while still being as small as possible. The 2-nanometer chip would reduce size and cut power consumption, while also helping to keep heat down. Memory would also be upgraded to 12GB for all models.
